K4R271669D Datasheet, PDF (20/20 Pages) Samsung semiconductor – 128Mbit RDRAM(D-die)

K4R271669D
Center-Bonded Fanout Package
(54 Balls)
Figure 4 shows the form and dimensions of the recom-
mended package for the center-bonded Fanout CSP device
class.
D
A BCDE FGH J
Bottom
1
2
3
4
A
5
e2
6
7
Preliminary
Direct RDRAM^™
Bottom
Top
d
e1
E1
Bottom
E
Figure 4: Center-Bonded Fanout CSP Package
Table 19 lists the numerical values corresponding to dimen-
sions shown in Figure 4
Table 19: Center-Bonded Fanout CSP Package Dimension
Symbol
Parameter
Min
e1
Ball pitch (x-axis)
1.27
e2
Ball pitch (y-axis)
1.27
A
Package body length
11.9
D
Package body width
11.7
E
Package total thickness
-
E1
Ball height
0.45
d
Ball diameter
0.55
Max
Unit
1.27
mm
1.27
mm
12.1
mm
11.9
mm
1.25
mm
0.55
mm
0.65
mm
Page 18
Version 1.0 Dec. 2001