K4H561638N-LCB3T00 Datasheet, PDF (17/24 Pages) Samsung semiconductor – N-die DDR SDRAM

K4H560438N
K4H560838N
K4H561638N
datasheet
Rev. 1.01
DDR SDRAM
20. System Characteristics for DDR SDRAM
The following specification parameters are required in systems using DDR400 and DDR333 devices to ensure proper system performance. these char-
acteristics are for system simulation purposes and are guaranteed by design.
[ Table 1 ] Input Slew Rate for DQ, DQS, and DM
AC CHARACTERISTICS
PARAMETER
DQ/DM/DQS input slew rate measured between
V_IH(DC), V_IL(DC) and V_IL(DC), V_IH(DC)
SYMBOL
DDR400
MIN
MAX
DCSLEW 0.5
4.0
[ Table 2 ] Input Setup & Hold Time Derating for Slew Rate
Input Slew Rate
ΔtIS
ΔtIH
0.5 V/ns
0
0
0.4 V/ns
+50
0
0.3 V/ns
+100
0
Units
ps
ps
ps
DDR333
MIN
MAX
0.5
4.0
NOTE
i
i
i
DDR266
MIN
MAX
0.5
4.0
Units NOTE
V/ns
a, l
[ Table 3 ] Input/Output Setup & Hold Time Derating for Slew Rate
Input Slew Rate
ΔtDS
ΔtDH
0.5 V/ns
0
0
0.4 V/ns
+75
+75
0.3 V/ns
+150
+150
Units
ps
ps
ps
NOTE
k
k
k
[ Table 4 ] Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate
Delta Slew Rate
ΔtDS
ΔtDH
Units
+/- 0.0 V/ns
0
0
ps
+/- 0.25 V/ns
+50
+50
ps
+/- 0.5 V/ns
+100
+100
ps
NOTE
j
j
j
[ Table 5 ] Output Slew Rate Characteristice (X4, X8 Devices only)
Slew Rate Characteristic
Typical Range
(V/ns)
Pull-up Slew Rate
1.2 ~ 2.5
Pull-down slew
1.2 ~ 2.5
Minimum
(V/ns)
1.0
1.0
Maximum
(V/ns)
4.5
4.5
NOTE
a,c,d,f,g,h
b,c,d,f,g,h
[ Table 6 ] Output Slew Rate Characteristice (X16 Devices only)
Slew Rate Characteristic
Typical Range
(V/ns)
Pull-up Slew Rate
1.2 ~ 2.5
Pull-down slew
1.2 ~ 2.5
Minimum
(V/ns)
0.7
0.7
Maximum
(V/ns)
5.0
5.0
NOTE
a,c,d,f,g,h
b,c,d,f,g,h
[ Table 7 ] Output Slew Rate Matching Ratio Characteristics
AC CHARACTERISTICS
DDR400
PARAMETER
MIN
MAX
Output Slew Rate Matching Ratio (Pullup to Pulldown)
0.67
1.5
DDR333
MIN
MAX
0.67
1.5
DDR266
MIN
MAX
0.67
1.5
NOTE
e, l
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