BD9E303EFJ-LB Datasheet, PDF (23/31 Pages) Rohm – Over-Current Protection

BD9E303EFJ-LB
Datasheet
Power Dissipation
Take into careful consideration that the power dissipation is within the allowable dissipation curve to design the PCB layout
and peripheral circuits.
HTSOP-J8
4.0
3.0
2.76W
Mounting on ROHM standard board based on JEDEC.
Board specification: FR4 (Glass-Epoxy), 114.3mm × 76.2 mm ×1.6 mm
2.0
1.0
0
0
Copper foil on the front side: ROHM recommended land pattern +
wiring to measure.
PCB: 4-layer PCB
(copper foil area on 2nd & 3rd layer and reverse side,
74.2 mm × 74.2 mm)
25
50
75 100 125
Temperature:Ta [°C]
Copper foil thickness: Front side and reverse side 70µm be used,
2nd & 3rd 35µm be used.
150 ^{Condition: θ}JA ^{= 45.2 °C / W}
Figure 48. Power Dissipation (HTSOP-J8)
I/O equivalence circuit(s)
1. BOOT 8. SW
BOOTREG
BOOT
VIN
3. EN
SW
REG
PGND
5. FB
6. COMP
Figure 49. I/O Equivalent Circuit Chart
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TSZ22111•15•001
23/28
TSZ02201-0J3J0AJ00650-1-2
13.Feb.2015 Rev.002