BD9E303EFJ-LB Datasheet, PDF (2/31 Pages) Rohm – Over-Current Protection

BD9E303EFJ-LB
Datasheet
Pin Configuration
BOOT ¹
VIN 2
EN ³
AGND 4
(TOP VIEW)
E-Pad
8 SW
7 PGND
6 COMP
5 FB
Figure 2. Pin assignment
Pin Description(s)
Pin No Pin Name
Description
1
BOOT
Connect a bootstrap capacitor of 0.1µF between this terminal and SW terminal.
The voltage of this capacitor is the gate drive voltage of the high-side MOSFET.
2
VIN
Power supply terminal for the switching regulator and control circuit.
Connecting a 10µF and 0.1µF ceramic capacitor is recommended.
Turning this terminal signal low-level (0.8V or lower) forces the device to enter the shut
3
EN
down mode. Turning this terminal signal high-level (2.5V or higher) enables the device.
This terminal must be terminated.
4
AGND Ground terminal for the control circuit.
5
FB
Inverting input node for the gm error amplifier.
See page 18 on how to calculate the resistance of the output voltage setting.
Output of gm error amplifier, and input of PWM comparator. Connect phase
6
COMP compensation components to this pin. See page 20 on how to calculate the resistance
and capacitance for phase compensation.
7
PGND Ground terminal for the output stage of the switching regulator.
Switch node. This terminal is connected to the source of the high-side MOSFET and
8
SW
drain of the low-side MOSFET. Connect a bootstrap capacitor of 0.1µF between this
terminal and BOOT terminal. In addition, connect an inductor considering the direct
current superimposition characteristic.
-
E-Pad
Exposed pad. Connecting this to the internal PCB ground plane using multiple vias
provides excellent heat dissipation characteristics.
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TSZ02201-0J3J0AJ00650-1-2
13.Feb.2015 Rev.002