RF5623 Datasheet, PDF (5/18 Pages) RF Micro Devices – SINGLE 5.0V, 3.3 TO 3.8 GHZ LINEAR POWER AMPLIFIER

RF5623
PCB Metal Land and Solder Mask Pattern
Note: If it is desired to build the same PCB to accommodate the RF5602 as well as the RF5623/RF5603 use the following PCB
Patterns.
Note: Thermal vias for center slug “C” should be incorporated into the PCB design. The number and size of thermal vias will
depend on the application. Example of the number and size of vias can be found on the RFMD evaluation board layout.
DS120213
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at ([phone] or [e-mail].
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