RF5623 Datasheet, PDF (4/18 Pages) RF Micro Devices – SINGLE 5.0V, 3.3 TO 3.8 GHZ LINEAR POWER AMPLIFIER

RF5623
Note: Thermal vias for center slug "B" should be incorporated into the PCB design. The number and size of thermal vias will
depend on the application, the power dissipation, and the electrical requirements. Example of the number and size of vias can
be found on the RFMD evaluation board layout.
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