RFAM3790 Datasheet, PDF (4/7 Pages) RF Micro Devices – 45-1218MHZ GAAS EDGE QAM INTEGRATED AMPLIFIER

RFAM3790
Evaluation Board Assembly Drawing
ATT POWER
ADJUST ENABLE
GND V+
RF_IN
J1
C8
C9
C1
C2 ^D1
TR1
C3
D3
Fb1
R1
D2
C4
D4
C6
C5 C7
TR3
TR2
RF_OUT
J2
EVALUATION-BOARD RRFFAAMM23779900PECDBAA5-34310
Note:
The ground plane of the RFAM3790 module should be soldered onto a board equipped with as many thermal vias as possible.
Underneath this thermal via array a heat sink with thermal grease needs to be placed which is able to dissipate the complete module DC
power. In any case the module backside temperature should not exceed 100°C.
RF Micro Devices Inc. 7628 Thorndike Road, Greensboro, NC 27409-9421
For sales or technical support, contact RFMD at +1.336.678.5570 or [e-mail].
DS140820
The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of
third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended
application circuitry and specifications at any time without prior notice.
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