PD17012GF-058_15 Datasheet, PDF (89/94 Pages) Renesas Technology Corp – PLL FREQUENCY SYNTHESIZER AND CONTROLLER FOR FM/MW/LW TUNER (AUTOMOBILE APPLICATION)

µPD17012GF-058
12. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the µPD17012GF-058.
For details of the recommended soldering conditions, refer to our document SMD Surface Mount Technology
Manual (C10535E).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 12-1. Soldering Conditions for Surface-Mount Devices
µPD17012GF-058-3BE: 64-pin plastic QFP (14 × 20 mm, 0.1 mm pitch)
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Soldering conditions
Peak package’s surface temperature: 235 ˚C
Reflow time: 30 seconds or less (at 210 ˚C or more)
Maximum allowable number of reflow processes: 2
Exposure limit^Note: 7 days (20 hours of pre-baking is required at
125 ˚C afterward.)
<Cautions>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
backed before unpacking.
Peak package’s surface temperature: 215 ˚C
Reflow time: 40 seconds or less (at 200 ˚C or more)
Maximum allowable number of reflow processes: 2
Exposure limit^Note: 7 days (20 hours of pre-baking is required at
125 ˚C afterward.)
<Cautions>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
backed before unpacking.
Temperature in the soldering vessel: 260 ˚C or less
Soldering time: 10 seconds or less
Number of soldering processes: 1
Pre-heating temperature: 120 ˚C max.
(package surface temperature)
Exposure limit^Note: 7 days
(20 hours of pre-baking is required at 125 ˚C afterward.)
<Cautions>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
backed before unpacking.
Terminal temperature: 300 ˚C or less
Flow time: 3 seconds or less (for each side of device)
Symbol
IR35-207-2
VP15-207-2
WS60-207-1
-
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: Temperature of 25 ˚C and maximum relative humidity at 65 % or less
Caution Do not apply more than a single process at once, except for "Partial heating method."
87