PD178002_15 Datasheet, PDF (41/50 Pages) Renesas Technology Corp – 8-BIT SINGLE-CHIP MICROCONTROLLERS

µPD178002, 178003
12. RECOMMENDED SOLDERING CONDITIONS
The µPD178002 and 178003 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales represen-
tative.
Table 12-1. Surface Mounting Type Soldering Conditions
µPD178002GC-×××-3B9: 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
µPD178003GC-×××-3B9: 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Three times or less
IR35-00-3
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher), VP15-00-3
Count: Three times or less
Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., Count: once,
Preheating temperature: 120°C max. (package surface temperature)
WS60-00-1
Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
—
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet U12628EJ3V0DS00
39