H8S2282 Datasheet, PDF (30/615 Pages) Renesas Technology Corp – 16-Bit Single-Chip Microcomputer H8S Family/H8S/2200 Series

Section 16 Flash Memory (F-ZTAT Version) [H8S/2282 Group]
Table 16.1 Differences between Boot Mode and User Program Mode.................................... 417
Table 16.2 Pin Configuration ................................................................................................... 421
Table 16.3 Setting On-Board Programming Modes................................................................. 426
Table 16.4 Boot Mode Operation............................................................................................. 428
Table 16.5 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate Is
Possible .................................................................................................................. 428
Table 16.6 Flash Memory Operating States ............................................................................. 439
Section 17 Flash Memory (F-ZTAT Version) [H8S/2280 Group]
Table 17.1 Differences between Boot Mode and User Program Mode.................................... 443
Table 17.2 Pin Configuration ................................................................................................... 447
Table 17.3 Setting On-Board Programming Modes................................................................. 450
Table 17.4 Boot Mode Operation............................................................................................. 452
Table 17.5 System Clock Frequencies for which Automatic Adjustment of LSI Bit Rate Is
Possible .................................................................................................................. 452
Table 17.6 Flash Memory Operating States ............................................................................. 460
Section 18 Mask ROM
Table 18.1 Register Present in F-ZTAT Version but Absent in Masked ROM Version .......... 462
Section 19 Clock Pulse Generator
Table 19.1 Damping Resistance Value .................................................................................... 467
Table 19.2 Crystal Resonator Characteristics........................................................................... 468
Table 19.3 External Clock Input Conditions ............................................................................ 469
Section 20 Power-Down Modes
Table 20.1 Power-Down Mode Transition Conditions............................................................. 475
Table 20.2 LSI Internal States in Each Mode........................................................................... 476
Table 20.3 Oscillation Stabilization Time Settings .................................................................. 486
Table 20.4 φ Pin State in Each Processing State ...................................................................... 495
Section 22 Electrical Characteristics
Table 22.1 Absolute Maximum Ratings................................................................................... 541
Table 22.2 DC Characteristics.................................................................................................. 542
Table 22.3 Permissible Output Currents .................................................................................. 545
Table 22.4 Clock Timing ......................................................................................................... 546
Table 22.5 Control Signal Timing............................................................................................ 548
Table 22.6 Timing of On-Chip Supporting Modules ............................................................... 550
Table 22.7 A/D Conversion Characteristics ............................................................................. 555
Rev. 3.00 Sep 26, 2006 page xxx of xxxii