PD16753_15 Datasheet, PDF (20/22 Pages) Renesas Technology Corp – 384-OUTPUT TFT-LCD SOURCE DRIVER (COMPATIBLE WITH 256-GRAY SCALES)

µ PD16753
11. RECOMMENDED SOLDERING CONDITIONS
The following conditions must be met for soldering conditions of the µ PD16753.
For more details, refer to the Semiconductor Device Mounting Technology Manual (C10535E).
Please consult with our sales offices in case other soldering process is used, or in case the soldering is done
under different conditions.
µ PD16753N - ×××: TCP (TAB package)
Mounting Condition
Mounting Method
Thermocompression
Soldering
ACF
(Adhesive Conductive
Film)
Condition
Heating tool 300 to 350°C, heating for 2 to 3 seconds, pressure 100g (per
solder)
Temporary bonding 70 to 100°C, pressure 3 to 8 kg/cm², time 3 to 5
seconds.
Real bonding 165 to 180°C, pressure 25 to 45 kg/cm², time 30 to 40
seconds. (When using the anisotropy conductive film SUMIZAC1003 of
Sumitomo Bakelite, Ltd.)
Caution To find out the detailed conditions for mounting the ACF part, please contact the ACF manufacturing
company. Be sure to avoid using two or more mounting methods at a time.
18
Data Sheet S15630EJ1V0DS