PD16754_15 Datasheet, PDF (19/21 Pages) Renesas Technology Corp – 384-OUTPUT TFT-LCD SOURCE DRIVER (COMPATIBLE WITH 256-GRAY SCALES)

µPD16754
5 10. RECOMMENDED MOUNTING CONDITIONS
The following conditions must be met for mounting conditions of the µPD16754.
For more details, refer to the Semiconductor Device Mount Manual
(http://www.necel.com/pkg/en/mount/index.html).
Please consult with our sales offices in case other mounting process is used, or in case the mounting is done under
different conditions.
µ PD16754N - ×××: TCP (TAB package)
Mounting Condition
Mounting Method
Thermocompression
Soldering
ACF
(Adhesive Conductive
Film)
Condition
Heating tool 300 to 350°C, heating for 2 to 3 seconds, pressure 100 g (per
solder)
Temporary bonding 70 to 100°C, pressure 3 to 8 kg/cm², time 3 to 5
seconds.
Real bonding 165 to 180°C, pressure 25 to 45 kg/cm², time 30 to 40
seconds. (When using the anisotropy conductive film SUMIZAC1003 of
Sumitomo Bakelite, Ltd.)
Caution To find out the detailed conditions for mounting the ACF part, please contact the ACF manufacturing
company. Be sure to avoid using two or more mounting methods at a time.
Data Sheet S16434EJ1V0DS
17