PD3719_15 Datasheet, PDF (18/22 Pages) Renesas Technology Corp – MOS INTEGRATED CIRCUIT

µPD3719
NOTES ON THE USE OF THE PACKAGE
The application of an excessive load to the package may cause the package to warp or break, or cause chips to
come off internally. Particular care should be taken when mounting the package on the circuit board.
When mounting the package, use a circuit board which will not subject the package to bending stress, or use a
socket.
For this product, the reference value for the three-point bending strength^Note is 30 kg. Avoid imposing a load,
however, on the inside portion as viewed from the face on which the window (glass) is bonded to the package body
(ceramic).
Note Three-point bending strength test
Distance between supports: 70 mm, Support R: R 2 mm, Loading rate: 0.5 mm / min.
Load
Load
70 mm
70 mm
16