HYS72T1G042ER Datasheet, PDF (4/31 Pages) Qimonda AG – 240-Pin Dual Die Registered DDR2 SDRAM Modules

Internet Data Sheet
HYS72T1G042ER–5–B
Registerd DDR2 SDRAM Module
1.2
Description
The QIMONDA HYS72T1G042ER–5–B module family are
Registered DIMM modules “RDIMMs” with 42 mm height
based on DDR2 technology. DIMMs are available ECC
modules in 1024M × 72 (8 GB) organization and density,
intended for mounting into 240-pin connector sockets.
The memory array is designed with stacked 1-Gbit Double-
Data-Rate-Two (DDR2) Synchronous DRAMs. All control
and address signals are re-driven on the DIMM using
register devices and a PLL for the clock distribution.
This reduces capacitive loading to the system bus, but
adds one cycle to the SDRAM timing. Decoupling
capacitors are mounted on the PCB board. The DIMMs
feature serial presence detect based on a serial E²PROM
device using the 2-pin I²C protocol. The first 128 bytes are
programmed with configuration data and are write protected;
the second 128 bytes are available to the customer.
Product Type¹⁾
Compliance Code²⁾
TABLE 2
Ordering Information for RoHS Compliant Products
Description
SDRAM
Technology
PC2–3200
HYS72T1G042ER–5–B
8 GB 4R×4 PC2–3200R–333–12–ZZ
4 Ranks, ECC
2 × 256Mbit( × 4 )
1) All Product Type numbers end with a place code, designating the silicon die revision. Example: HYS72T1G042ER–5–B, indicating Rev.
“B” dies are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see Chapter 6 of this data
sheet.
2) The Compliance Code is printed on the module label and describes the speed grade, for example “4R×4 PC2–3200R–333–12–ZZ”, where
3200R means Registered DIMM modules with 3.2 GB/sec Module Bandwidth and “333-12” means Column Address Strobe (CAS) latency
= 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.2 and produced
on the Raw Card “Z”.
DIMM
Density
8 GByte
Module
Organization
1024M × 72
Memory
Ranks
4
ECC/
Non-ECC
ECC
TABLE 3
Address Format
# of SDRAMs # of row/bank/column
bits
Raw
Card
36
14/3/11
Z
Product Type¹⁾
DRAM Components¹⁾
DRAM Density
TABLE 4
Components on Modules
DRAM Organisation Note²⁾
HYS72T1G042ER
HYB18T2G402BF
1 Gbit
2 × 256M × 4
1) Green Product
2) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet.
Rev. 1.0, 2007-04
4
04242007-NQ2Z-YM3O