|
PE99151DIE Datasheet, PDF (5/15 Pages) Peregrine Semiconductor – Hi-Rel 2A DC-DC Converter | |||
|
◁ |
PE99151 DIE
Product Specification
Table 3. Pin Coordinates and Descriptions
(continued)
Pin
No.
Pin Name
X
Y
Description
25
EAINP
â1343.9
1068.3
Error Amplifier (+) Input,
Load Feedback
1.000V Reference output,
26
VREF
â1343.9
1266.9
Loop to AAINP. Additional
Low Pass Filtering May be
Necessary
27
GND
â1343.9 1437.25 Ground
28
AGND
â1142.8 1283.2 Bandgap ground
29
RSET
â1142.8
â1283.2
Resistor to Set Reference
Current
30
SScap
â944.2
1283.2
Resistor to Set Reference
Current
31
SYNCOb
â944.2
â1283.2
Loop-Through Comple-
ment Output
32
SYNC
â745.6
1283.2
Loop-Through Comple-
ment Output
33
PGOOD â745.6 â1283.2 Power Good Flag Output
34
SDb
â547 1283.2 Shutdown (L)/enable input
35
RSEL_SDAT
â547
â1283.2
Reference Resistor
Selection
36
TEST
â348.4 1283.2 Ground
37
SCLK
â348.4 â1283.2 Ground
38
VIN
602.5 1000 Input Power Supply
39
VIN
1102.5
0 Input Power Supply
40
VIN
602.5 â1000 Input Power Supply
Table 4. Operating Ranges
Symbol
Parameter/Condition
VIN Power supply voltage
TA
Operating temperature range
(ambient)
Min Max Unit
4.6 6.0
V
â55 +125 °C
Table 5. Absolute Maximum Ratings
Symbol
Parameter/Condition
Min Max Unit
VIN Power supply voltage
Tj
Operating temperature range
(junction)
â0.5 6.5
V
â55 +145 oC
TST Storage temperature range
â65 +150 oC
II
DC into any signal input
â10 10 mA
IO
DC into any signal output
â50 50 mA
IP
DC into any single power pin
â2 2
A
Exceeding absolute maximum ratings may cause
permanent damage. Operation between maximum
operating range and absolute maximum for
extended periods may reduce reliability.
Table 6. Electrostatic Discharge (ESD) Ratings
Model
Parameter/Condition
Min Max Unit
HBM* VESD All pins
1000
V
Note: * Human Body Model ESD Voltage (HBM, MIL_STD 883 Method 3015.7).
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS device, observe the
same precautions that you would use with other
ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the specified rating.
Latch-Up Immunity
Unlike conventional CMOS devices, UltraCMOS
devices are immune to latch-up.
ELDRS
The UltraCMOS process does not exhibit enhanced
low-dose-rate sensitivity (ELDRS) since bipolar
minority carrier elements are not used.
Document No. DOC-50370-6 â www.e2v-us.com
©2012â2015 Peregrine Semiconductor Corp. All rights reserved.
Page 5 of 15
|
▷ |