|
UMA1015AM Datasheet, PDF (7/24 Pages) NXP Semiconductors – Low-power dual frequency synthesizer for radio communications | |||
|
◁ |
Philips Semiconductors
Low-power dual frequency synthesizer
for radio communications
Product speciï¬cation
UMA1015AM
Table 5 Charge pump current ratio
CRA/CRB
0
1
CURRENT AT PUMP
ICP = 12 Ã ISET
ICP = 24 Ã ISET
Table 6 Reference division ratio
SR
SYNTHESIZER A
0
R
1
R
SYNTHESIZER B
R
2R
Power-down modes
The device can be powered down either via pin HPD
(active LOW = power-down) or via the serial bus
(bits sPDA and sPDB, logic 0 = power-down).
The synthesizers are powered up when both hardware
and software Power-down signals are at logic 1. When
only one synthesizer is powered down, the functions
common to both will be maintained (independent of the
state of sPBF). When both synthesizers are powered
down, the fxtal buffer can be maintained in an active state
by setting sPBF to logic 1. This will allow any system clock
derived from the fXTALO buffered output to remain on in
power-down. Note that sPBF is independent of the state of
HPD. When both synthesizers are switched off, the
voltage doubler (if enabled) will remain active drawing a
reduced current. An internal oscillator will drive the doubler
in this situation. If both synthesizers have been in a
power-down condition, then when one or both
synthesizers are reactivated, the reference and main
dividers restart in such a way as to avoid large random
phase errors at the phase comparator.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
MIN.
VDD1, VDD2 DC range of digital power supply voltage with respect to DGND
â0.3
VCC
DC charge pump supply voltage with respect to AGND
â0.3
âVCC-DD difference in voltage between VCC and VDD1, VDD2
â0.3
Vn
DC voltage at pins 1, 2, 5, 6, 8 to 15, 19 and 20 with respect to DGND â0.3
V3, 17
DC voltage at pins 3 and 17 with respect to AGND
â0.3
âVGND
difference in voltage between AGND and DGND (these pins should be â0.3
connected together)
Tstg
storage temperature
â55
Tamb
operating ambient temperature
â30
MAX.
UNIT
+6.0
V
+6.0
V
+6.0
V
VDD1 + 0.3 V
VCC + 0.3 V
+0.3
V
+125
°C
+85
°C
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
1997 Sep 03
7
|
▷ |