74F573 Datasheet, PDF (6/14 Pages) NXP Semiconductors – Octal transparent latch 3-State

Philips Semiconductors
Latch/flip-flop
Product specification
74F573/74F574
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST CONDITIONS^{NO TAG}
LIMITS
MIN
TYP MAX
NO TAG
UNIT
V_OH
High-level output voltage
V_CC = MIN, V_IL = MAX,
V_IH = MIN, I_OH = MAX
±10%V_CC
2.4
±5%V_CC
2.7
3.4
V
V
V_OL
Low-level output voltage
V_CC = MIN, V_IL = MAX,
V_IH = MIN, I_OL = MAX
±10%V_CC
±5%V_CC
0.35 0.50
V
0.35 0.50
V
V_IK
Input clamp voltage
I_I
Input current at
maximum input voltage
V_CC = MIN, I_I = I_IK
V_CC = MAX, V_I = 7.0V
–0.73 –1.2
V
100
µA
I_IH
I_IL
I_OZH
High-level input current
Low-level input current
Off-state output current,
High-level voltage applied
V_CC = MAX, V_I = 2.7V
V_CC = MAX, V_I = 0.5V
V_CC = MAX, V_O = 2.7V
20
µA
–0.6
mA
50
µA
I_OZL
Off-state output current,
Low-level voltage applied
V_CC = MAX, V_O = 0.5V
–50
µA
I_OS
Short-circuit output current^{NO TAG}
V_CC = MAX
–60
–150
mA
I_CCH
30
40
mA
I_CCL
74F573
I_CC
Supply
current
I_CCZ
(total)
I_CCH
V_CC = MAX
35
50
mA
40
60
mA
45
65
mA
I_CCL
74F574
V_CC = MAX
50
70
mA
I_CCZ
55
85
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V_CC = 5V, T_amb = 25°C.
3. Not more than one output should be shorted at a time. For testing I_OS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I_OS tests should be performed last.
1989 Oct 16
6