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BYC10DX-600_15 Datasheet, PDF (5/12 Pages) NXP Semiconductors – Hyperfast power diode
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NXP Semiconductors
BYC10DX-600
Hyperfast power diode
5. Thermal characteristics
Table 5.
Symbol
Rth(j-h)
Thermal characteristics
Parameter
thermal resistance from junction to
heatsink
Rth(j-a)
thermal resistance from junction to
ambient free air
Conditions
without heatsink compound
with heatsink compound ;
see Figure 4
Min Typ Max Unit
-
-
5.9 K/W
-
-
4.8 K/W
-
60
-
K/W
10
Zth(j-h)
(K/W)
1
001aaf257
10−1
P
tp
δ=
T
10−2
10−3
10−6
10−5 10−4
10−3 10−2
tp
T
10−1
t
1 10
tp (s)
Fig 4. Transient thermal impedance from junction to heatsink as a function of pulse width
6. Isolation characteristics
Table 6.
Symbol
Visol(RMS)
Cisol
Isolation characteristics
Parameter
RMS isolation voltage
Conditions
50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; from all pins to
external heatsink; sinusoidal waveform; clean
and dust free
isolation capacitance f = 1 MHz ; from cathode to external heatsink
Min Typ Max Unit
-
-
2500 V
-
10 -
pF
BYC10DX-600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 June 2011
© NXP B.V. 2011. All rights reserved.
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