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BUK765R2-40B_15 Datasheet, PDF (5/14 Pages) NXP Semiconductors – N-channel TrenchMOS standard level FET
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NXP Semiconductors
BUK765R2-40B
N-channel TrenchMOS standard level FET
5. Thermal characteristics
Table 5.
Symbol
Rth(j-mb)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to
mounting base
thermal resistance from junction to
ambient
Conditions
see Figure 4
minimum footprint ; mounted on a
printed-circuit board
Min Typ Max Unit
-
-
0.74 K/W
-
50
-
K/W
1
Zth(j-mb)
(K/W)
δ = 0.5
0.2
10−1 0.1
0.05
0.02
10−2
03nj25
P
δ = tp
T
single shot
10−3
10−6
10−5
10−4
10−3
10−2
tp
t
T
10−1
1
tp (s)
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
BUK765R2-40B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 22 November 2011
© NXP B.V. 2011. All rights reserved.
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