BUK1M200-50SDLD Datasheet, PDF (5/14 Pages) NXP Semiconductors – Quad channel TOPFET

Philips Semiconductors
BUK1M200-50SDLD
Quad channel TOPFET™
120
Pder
(%)
80
03aa17
40
0
0
50
100
150
200
Tsp (°C)
P_der
=
-------^P----^t--^o---^t-------
P
×
100%
t o t ( 25 ^°C )
Fig 4. Normalized total power dissipation as a function of solder point temperature.
5. Thermal characteristics
Table 4:
Symbol
R_th(j-sp)
Thermal characteristics
Parameter
Conditions
thermal resistance from junction to mounted on thermo clad board
solder point.
one device active
all devices active
Min Typ Max Unit
-
-
45 K/W
-
-
13.3 K/W
9397 750 10956
Product data
Rev. 01 — 02 April 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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