BUK130-50DL Datasheet, PDF (5/6 Pages) NXP Semiconductors – Logic level TOPFET SMD version of BUK119-50DL

Philips Semiconductors
Logic level TOPFET
SMD version of BUK119-50DL
MECHANICAL DATA
Plastic single-ended surface mounted package (Philips version of D²-PAK); 3 leads
(one lead cropped)
Product specification
BUK130-50DL
SOT404
D1
D
HD
E
2
1
3
b
e
e
A
A1
mounting
base
Lp
c
Q
0
2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
b
D
c _max. D1
E
e
mm ^{4.50 1.40 0.85 0.64} 11 ^{1.60 10.30} 2.54
4.10 1.27 0.60 0.46
1.20 9.70
Lp
HD
Q
2.90 15.40 2.60
2.10 14.80 2.20
OUTLINE
VERSION
IEC
SOT404
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
98-12-14
99-06-25
Fig.2. SOT404 surface mounting package¹, centre pin connected to mounting base.
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.4 g
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
May 2001
5
Rev 1.900