TDA8932B_15 Datasheet, PDF (48/48 Pages) NXP Semiconductors – Class-D audio amplifier

NXP Semiconductors
TDA8932B
Class-D audio amplifier
21. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.4
8.4.1
8.4.2
8.4.3
8.4.4
8.4.5
8.5
8.6
8.7
9
10
11
12
13
14
14.1
14.2
14.3
14.4
14.5
14.6
14.7
14.8
14.9
14.10
14.11
15
16
16.1
16.2
16.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Mode selection and interfacing . . . . . . . . . . . . . 6
Pulse width modulation frequency . . . . . . . . . . 7
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal Foldback (TF) . . . . . . . . . . . . . . . . . . . 9
OverTemperature Protection (OTP) . . . . . . . . . 9
OverCurrent Protection (OCP) . . . . . . . . . . . . . 9
Window Protection (WP). . . . . . . . . . . . . . . . . . 9
Supply voltage protection . . . . . . . . . . . . . . . . 10
Diagnostic input and output . . . . . . . . . . . . . . 11
Differential inputs . . . . . . . . . . . . . . . . . . . . . . 11
Output voltage buffers. . . . . . . . . . . . . . . . . . . 11
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 12
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 16
Thermal characteristics. . . . . . . . . . . . . . . . . . 16
Static characteristics. . . . . . . . . . . . . . . . . . . . 17
Dynamic characteristics . . . . . . . . . . . . . . . . . 19
Application information. . . . . . . . . . . . . . . . . . 22
Output power estimation. . . . . . . . . . . . . . . . . 22
Output current limiting. . . . . . . . . . . . . . . . . . . 24
Speaker configuration and impedance . . . . . . 24
Single-ended capacitor . . . . . . . . . . . . . . . . . . 24
Gain reduction . . . . . . . . . . . . . . . . . . . . . . . . 25
Device synchronization . . . . . . . . . . . . . . . . . . 26
Thermal behavior (printed-circuit board
considerations) . . . . . . . . . . . . . . . . . . . . . . . . 26
Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 27
SE curves measured in reference design. . . . 29
BTL curves measured in reference design . . . 33
Typical application schematics (simplified) . . . 37
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 41
Soldering of SMD packages . . . . . . . . . . . . . . 43
Introduction to soldering . . . . . . . . . . . . . . . . . 43
Wave and reflow soldering . . . . . . . . . . . . . . . 43
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 43
16.4
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 44
17
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 45
18
Revision history . . . . . . . . . . . . . . . . . . . . . . . 46
19
Legal information . . . . . . . . . . . . . . . . . . . . . . 47
19.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 47
19.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
19.3
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 47
19.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 47
20
Contact information . . . . . . . . . . . . . . . . . . . . 47
21
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 18 December 2008
Document identifier: TDA8932B_4