TDA8932B_15 Datasheet, PDF (2/48 Pages) NXP Semiconductors – Class-D audio amplifier

NXP Semiconductors
TDA8932B
Class-D audio amplifier
4. Quick reference data
Table 1. Quick reference data
V_P = 22 V; f_osc = 320 kHz; T_amb = 25 °C; unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max Unit
Supplies
V_P
I_P
I_q(tot)
supply voltage
supply current
total quiescent
current
asymmetrical supply
Sleep mode
Operating mode; no load, no
snubbers and no filter
connected
10 22 36 V
-
145 195 µA
-
40 50 mA
Stereo SE channel; R_s < 0.1 Ω^[1]
P_o(RMS) RMS output power continuous time output power
per channel;
THD+N = 10 %; f_i = 1 kHz
R_L = 4 Ω; V_P = 22 V
13.8 15.3 -
W
R_L = 8 Ω; V_P = 30 V
14.0 15.5 -
W
short time output power per
[2]
channel; THD+N = 10 %;
f_i = 1 kHz
R_L = 4 Ω; V_P = 29 V
23.8 26.5 -
W
Mono BTL; R_s < 0.1 Ω^[1]
P_o(RMS) RMS output power continuous time output power;
THD+N = 10 %; f_i = 1 kHz
R_L = 4 Ω; V_P = 12 V
15.5 17.2 -
W
R_L = 8 Ω; V_P = 22 V
28.9 32.1 -
W
short time output power;
[2]
THD+N = 10 %; f_i = 1 kHz
R_L = 8 Ω; V_P = 29 V
49.5 55.0 -
W
[1] Output power is measured indirectly; based on R_DSon measurement.
[2] Two layer application board (55 mm × 45 mm), 35 µm copper, FR4 base material in free air with natural
convection.
5. Ordering information
Table 2. Ordering information
Type number Package
Name
Description
TDA8932BT SO32
plastic small outline package; 32 leads;
body width 7.5 mm
TDA8932BTW HTSSOP32 plastic thermal enhanced thin shrink small outline
package; 32 leads; body width 6.1 mm; lead pitch
0.65 mm; exposed die pad
Version
SOT287-1
SOT549-1
TDA8932B_4
Product data sheet
Rev. 04 — 18 December 2008
© NXP B.V. 2008. All rights reserved.
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