TDA8932B_15 Datasheet, PDF (16/48 Pages) NXP Semiconductors – Class-D audio amplifier

NXP Semiconductors
TDA8932B
Class-D audio amplifier
10. Limiting values
Table 8. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
V_P
supply voltage
asymmetrical supply ^[1] −0.3
+40
V
V_x
voltage on pin x
IN1P, IN1N, IN2P, IN2N
[2] _−5
+5
V
OSCREF, OSCIO, TEST
POWERUP, ENGAGE,
DIAG
[3] _{VSSD(HW) − 0.3 5}
V
[4] _{VCGND − 0.3 6}
V
I_ORM
all other pins
repetitive peak output
current
maximum output
current limiting
[5] _{VSS − 0.3}
[6] ₄
V_DD + 0.3 V
-
A
T_j
T_stg
T_amb
junction temperature
storage temperature
ambient temperature
-
150
°C
−55
+150
°C
−40
+85
°C
P
power dissipation
-
5
W
V_esd
electrostatic discharge
voltage
HBM
MM
[7] _−2000
[8] _−200
+2000 V
+200
V
[1] V_P = V_DDP1 − V_SSP1 = V_DDP2 − V_SSP2.
[2] Measured with respect to pin INREF; V_x < V_DD + 0.3 V.
[3] Measured with respect to pin V_SSD(HW); V_x < V_DD + 0.3 V.
[4] Measured with respect to pin CGND; V_x < V_DD + 0.3 V.
[5] V_SS = V_SSP1 = V_SSP2; V_DD = V_DDP1 = V_DDP2.
[6] Current limiting concept.
[7] Human Body Model (HBM); R_s = 1500 Ω; C = 100 pF
For pins 2, 3, 11, 14 and 15 V_esd = ±1800 V.
[8] Machine Model (MM); R_s = 0 Ω; C = 200 pF; L = 0.75 µH.
11. Thermal characteristics
Table 9. Thermal characteristics
Symbol Parameter
Conditions
SO32 package
R_th(j-a)
thermal resistance from junction free air natural convection
to ambient
JEDEC test board
2 layer application board
Ψ_j-lead
thermal characterization
parameter from junction to lead
Ψ_j-top
thermal characterization
parameter from junction to top of
package
Min Typ Max Unit
[1] _-
41
44
K/W
[2] _-
44
-
K/W
-
-
30
K/W
[3] _-
-
8
K/W
TDA8932B_4
Product data sheet
Rev. 04 — 18 December 2008
© NXP B.V. 2008. All rights reserved.
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