TDA8932B_15 Datasheet, PDF (42/48 Pages) NXP Semiconductors – Class-D audio amplifier

NXP Semiconductors
TDA8932B
Class-D audio amplifier
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
SOT549-1
D
c
y
exposed die pad side
Z
Dh
32
17
E
A
X
HE
vM A
Eh
pin 1 index
1
e
A2
A1
16
wM
bp
(A3)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A1
A2
A3 bp
c
D⁽¹⁾ Dh
E⁽²⁾ Eh
e HE
mm
1.1
0.15
0.05
0.95
0.85
0.25
0.30 0.20
0.19 0.09
11.1
10.9
5.1
4.9
6.2
6.0
3.6
3.4
0.65
8.3
7.9
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT549-1
REFERENCES
JEDEC
JEITA
MO-153
L Lp
v
w
y
Z
θ
1
0.75
0.50
0.2
0.1
0.1
0.78
0.48
8^o
0^o
EUROPEAN
PROJECTION
ISSUE DATE
03-04-07
05-11-02
Fig 41. Package outline SOT549-1 (HTSSOP32)
TDA8932B_4
Product data sheet
Rev. 04 — 18 December 2008
© NXP B.V. 2008. All rights reserved.
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