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PMEG060V050EPD_15 Datasheet, PDF (4/15 Pages) NXP Semiconductors – 60 V, 5 A low VF MEGA Schottky barrier rectifier
NXP Semiconductors
PMEG060V050EPD
60 V, 5 A low VF MEGA Schottky barrier rectifier
9. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to
ambient
Conditions
in free air
Rth(j-sp)
thermal resistance
from junction to solder
point
Min Typ Max Unit
[1][2] -
-
90
K/W
[1][3] -
-
70
K/W
[1][4] -
-
40
K/W
[5]
-
-
3
K/W
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[5] Soldering point of cathode tab.
102
duty cycle = 1
Zth(j-a) 0.75
(K/W) 0.33
0.2
10
0.5
0.25
0.1
0.05
0.02
1
0.01
aaa-015000
0
10-1
10-3
10-2
10-1
1
FR4 PCB, standard footprint
10
102
103
tp (s)
Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG060V050EPD
Product data sheet
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22 January 2015
© NXP Semiconductors N.V. 2015. All rights reserved
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