BFQ270 Datasheet, PDF (4/12 Pages) NXP Semiconductors – NPN 6 GHz wideband transistor

Philips Semiconductors
Product specification
NPN 6 GHz wideband transistor
BFQ270
handbook, full pagewidth

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,

,,
,
^input
V _bias
R6
L1 C2
C7
L2
L1
R5
L3
VCC ⁽¹⁾
C4
C8
C9
L4
L2
L5
C5 L6
C6
output
n–75 Ω
n–75 Ω
DUT
C1
C3
R1 R2 R3 R4
MBB488
(1) +V_c is equivalent to V_CE = V_c − I_c (A) × 17.
Fig.2 Intermodulation and second order intermodulation distortion test circuit.
List of components (see test circuit)
DESIGNATION
DESCRIPTION
C1
miniature ceramic plate capacitor
C2, C5, C7, C8 multilayer ceramic capacitor
C3
multilayer ceramic chip capacitor
C4 (note 1)
miniature ceramic plate capacitor
C6
miniature ceramic plate capacitor
C9
electrolytic capacitor
L1 (note 1)
4.5 turns loosely wound 0.4 mm
enamelled copper wire
L2
Ferroxcube choke
ML1, ML6
microstripline
ML2, ML5
microstripline
ML3, ML4
microstripline
R1, R2, R3, R4
R5 (note 1)
R6
metal film resistor
metal film resistor
metal film resistor
VALUE
0.82 pF
10 nF
2.2 pF
1 nF
1.2 pF
4.7 µF
≈35 nH
5 µH
75 Ω
75 Ω
145 Ω
68 Ω
240 Ω
10 kΩ
DIMENSIONS
internal coil diameter
2 mm
width 2.46 mm;
length 9 mm
width 2.46 mm;
length 22 mm
width 0.5 mm;
length 12 mm
type MR25
type SFR16T
type SFR16T
Note
1. Components C4, L1, and R5 are mounted in a cavity in the brass ground plate.
CATALOGUE NO.
2222 680 03827
2222 852 47103
2222 855 12228
2222 630 08102
2222 680 03128
2222 014 28478
3122 108 20153
2322 151 76819
2322 180 73241
2322 180 73103
The circuit is constructed on a printed circuit board and 10 mm thick brass ground plate, with a relative dielectric constant
of (ε_r = 2.2), thickness 1.57 mm; thickness of copper 0.017 mm (E.G. Rogers’ RT/Duroid 5880).
September 1995
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