TDA8360 Datasheet, PDF (31/36 Pages) NXP Semiconductors – Integrated PAL and PAL/NTSC TV processors

Philips Semiconductors
Integrated PAL and PAL/NTSC TV
processors
PACKAGE OUTLINE
Objective specification
TDA8360; TDA8361; TDA8362
handbook, full pagewidth
3.2
2.8
1.73
max
52
1
47.92
47.02
1.778
(25x)
15.80
15.24
4.57 5.08
max max
0.51
min
0.18 M
0.53
max
1.3 max
0.32 max
15.24
17.15
15.90
MSA267
27
14.1
13.7
26
Dimensions in mm.
Fig.14 52-lead shrink dual in-line; plastic (SOT247AG).
SOLDERING
Plastic dual in-line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
REPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not
more than 2 mm above it). If its temperature is below
300 °C, it must not be in contact for more than 10 s; if
between 300 and 400 °C, for not more than 5 s.
March 1994
31