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PSS8050 Datasheet, PDF (3/10 Pages) NXP Semiconductors – NPN medium power 25 V transistor
Philips Semiconductors
NPN medium power 25 V transistor
Product specification
PSS8050
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-a
thermal resistance from junction to ambient
CONDITIONS
in free air; note 1
in free air; note 2
in free air; note 3
VALUE
147
139
125
UNIT
K/W
K/W
K/W
Notes
1. Device mounted on a printed-circuit board; single sided copper; tinplated; standard footprint.
2. Device mounted on a printed-circuit board; single sided copper; tinplated; mounting pad for collector 1 cm2.
3. Device mounted on a printed-circuit board; single sided copper; tinplated; standard footprint.
Operated under pulsed conditions: pulse width tp ≤ 1 s; duty cycle δ ≤ 0.75%.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
ICBO
ICEO
IEBO
hFE
VCEsat
VBEsat
VBEon
fT
Cc
collector-base cut-off current
VCB = 35 V; IE = 0
−
−
100 nA
VCB = 35 V; IE = 0; Tamb = 150 °C −
−
50
µA
collector-emitter cut-off current
VCE = 25 V; IB = 0
−
−
100 nA
emitter-base cut-off current
VEB = 6 V; IC = 0
−
−
100 nA
DC current gain
IC = 5 mA; VCE = 1 V
IC = 800 mA; VCE = 1 V
45
−
−
40
−
−
DC current gain
IC = 100 mA; VCE = 1 V
PSS8050C
120 −
200
PSS8050D
160 −
300
collector-emitter saturation voltage IC = 800 mA; IB = 80 mA
−
165 500 mV
base-emitter saturation voltage
base-emitter turn-on voltage
transition frequency
IC = 800 mA; IB = 80 mA
IC = 10 mA; VCE = 1 V
IC = 50 mA; VCE = 10 V;
f = 100 MHz
−
−
−
−
100 −
1.2 V
1
V
−
MHz
collector capacitance
VCB = 10 V; IE = ie = 0; f = 1 MHz −
−
10
pF
2004 Aug 10
3