PMEM1505PG Datasheet, PDF (3/11 Pages) NXP Semiconductors – PNP transistor/Schottky rectifier module

Philips Semiconductors
PMEM1505PG
PNP transistor/Schottky rectifier module
Table 5: Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
P_tot
total power dissipation
T_amb ≤ 25 °C ^[1] -
T_amb ≤ 25 °C ^[2] -
T_s ≤ 55 °C
[3] _-
T_j
junction temperature
-
Schottky barrier rectifier
V_R
continuous reverse voltage
-
I_F
continuous forward current
-
I_FSM
non-repetitive peak forward t = 8.3 ms
-
current
square wave
P_tot
total power dissipation
T_amb ≤ 25 °C ^[1] -
T_amb ≤ 25 °C ^[2] -
T_s ≤ 55 °C
[3] _-
T_j
junction temperature
[2] _-
Combined device
P_tot
T_stg
T_amb
total power dissipation
storage temperature
operating ambient
temperature
T_amb ≤ 25 °C
[2] _-
−65
[2] _−65
Max
200
250
800
150
20
0.5
5
200
250
800
125
300
+150
+150
Unit
mW
mW
mW
°C
V
A
A
mW
mW
mW
°C
mW
°C
°C
[1] Mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, standard footprint for SOT353.
[2] Device mounted on a printed-circuit board, single-sided copper, tin-plated, 1 cm² mounting pad for both
collector and cathode.
[3] Solder point of collector or cathode tab.
6. Thermal characteristics
Table 6: Thermal characteristics ^[1]
Symbol Parameter
Single device
R_th(j-s)
R_th(j-a)
from junction to solder point
from junction to ambient
Combined device
R_th(j-a)
from junction to ambient
Conditions
in free air
in free air
in free air
Typ
[2] ₁₂₀
[3] ₃₉₅
[4] ₄₉₅
[5] ₄₁₀
Unit
K/W
K/W
K/W
K/W
[1] For Schottky barrier rectifiers thermal run-away has to be considered, as in some applications the reverse
power losses P_R are a significant part of the total power losses. Nomograms for determining the reverse
power losses P_R and I_F(AV) rating will be available on request.
[2] Solder point of collector or cathode tab.
[3] Device mounted on a printed-circuit board, single-sided copper, tin-plated, 1 cm² mounting pad for both
collector and cathode.
[4] Mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, standard footprint for SOT353.
[5] Mounted on a ceramic printed-circuit board, single-sided copper, tin-plated, standard footprint.
9397 750 12751
Product data sheet
Rev. 01 — 26 May 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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