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BUK6212-40C_15 Datasheet, PDF (3/14 Pages) NXP Semiconductors – N-channel TrenchMOS intermediate level FET
NXP Semiconductors
BUK6212-40C
N-channel TrenchMOS intermediate level FET
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDS
VGS
Parameter
drain-source voltage
gate-source voltage
Conditions
Tj ≥ 25 °C; Tj ≤ 175 °C
Pulsed
DC
Min
-
[1]
-20
[2]
-16
ID
drain current
IDM
peak drain current
Tmb = 25 °C; VGS = 10 V; see Figure 1 [3]
-
Tmb = 100 °C; VGS = 10 V; see Figure 1
-
Tmb = 25 °C; tp ≤ 10 µs; pulsed;
-
see Figure 3
Ptot
total power dissipation
see Figure 2
-
Tstg
storage temperature
-55
Tj
junction temperature
-55
Source-drain diode
IS
source current
ISM
peak source current
Avalanche ruggedness
EDS(AL)S
non-repetitive drain-source
avalanche energy
EDS(AL)R
repetitive drain-source
avalanche energy
Tmb = 25 °C
tp ≤ 10 µs; pulsed; Tmb = 25 °C
ID = 50 A; Vsup ≤ 40 V; VGS = 10 V;
Tj(init) = 25 °C; unclamped
[3]
-
-
-
[4][5][6] -
[1] Accumulated pulse duration not to exceed 5 minutes.
[2] -16V accumulated duration not to exceed 168 hrs.
[3] Continuous current is limited by package.
[4] Single-pulse avalanche rating limited by maximum junction temperature of 175 °C.
[5] Repetitive avalanche rating limited by an average junction temperature of 170 °C.
[6] Refer to application note AN10273 for further information.
Max Unit
40 V
20 V
16 V
50 A
41 A
233 A
80 W
175 °C
175 °C
50 A
233 A
55 mJ
-
J
BUK6212-40C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 21 September 2010
© NXP B.V. 2010. All rights reserved.
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