TDA8769 Datasheet, PDF (24/28 Pages) NXP Semiconductors – 12-bit, 60/80/105 Msps Analog-to-Digital Converter (ADC) Nyquist/high IF sampling

Philips Semiconductors
12-bit, 60/80/105 Msps Analog-to-Digital Converter
(ADC) Nyquist/high IF sampling
12 PACKAGE OUTLINE
HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads;
body 7 x 7 x 1 mm; exposed die pad
Objective specification
TDA8769
SOT545-2
c
y
exposed die pad side
X
Dh
36
25
A
37
24 Z _E
Eh
48
1
e
pin 1 index
wM
b_p
D
HD
e
E ^HE
wM
b_p
13
12
ZD
vM A
B
vM B
A ^A2 _A1
detail X
(A ₃)
θ
L_p
L
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT _max. A1 A2 A3 bp
c D⁽¹⁾ Dh E⁽¹⁾ Eh
e
HD HE
mm
1.2
0.15
0.05
1.05
0.95
0.25
0.27
0.17
0.20
0.09
7.1
6.9
4.6
4.4
7.1
6.9
4.6
4.4
0.5
9.1
8.9
9.1
8.9
L Lp
v
w
y ZD⁽¹⁾ ZE⁽¹⁾ θ
1
0.75
0.45
0.2
0.08
0.08
0.89
0.61
0.89
0.61
7°
0°
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT545-2
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-08-04
03-04-07
2003 Dec 09
24