TDA8002 Datasheet, PDF (22/28 Pages) NXP Semiconductors – IC card interface

Philips Semiconductors
IC card interface
LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm
Product specification
TDA8002
SOT401-1
c
y
X
24
25
17
A
16 Z _E
32
1
e
pin 1 index
9
8
ZD
wM
b_p
D
B
HD
e
wM
b_p
E ^HE
vM A
vM B
A ^A2
A₁
detail X
(A ₃)
θ
L_p
L
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT _max. A₁ A₂ A₃ b_p
c
D⁽¹⁾ E⁽¹⁾ e
H_D
H_E
L
L_p v
w
y Z_D(1) Z_E(1) θ
mm
1.60
0.15
0.05
1.5
1.3
0.25
0.27
0.17
0.18
0.12
5.1
4.9
5.1
4.9
0.5
7.15
6.85
7.15
6.85
1.0
0.75
0.45
0.2
0.12
0.1
0.95 0.95
0.55 0.55
7^o
0^o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT401-1
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-12-19
97-08-04
1997 Nov 04
22