TDA8002 Datasheet, PDF (16/28 Pages) NXP Semiconductors – IC card interface

Philips Semiconductors
IC card interface
Product specification
TDA8002
SYMBOL
PARAMETER
CONDITIONS
Crystal connections (XTAL1 and XTAL2)
C_ext
external capacitors
f_xtal
resonance frequency
Data lines
note 1
note 2
GENERAL
t_edge
delay between falling edge of
I/O, AUX1, AUX2 and I/OUC,
AUX1UC, AUX2UC
delay between falling edge of
I/OUC, AUX1UC, AUX2UC and
I/O, AUX1, AUX2
t_r, t_f
rise and fall times
DATA LINES I/O, AUX1 AND AUX2
C_i = C_o = 30 pF
V_OH(I/O)
V_OL(I/O)
HIGH-level output voltage on
data lines
LOW-level output voltage on
data lines
I_OH = −20 µA
I_OH = −100 µA
I_I/O = 1 mA
V_IH(I/O)
HIGH-level input voltage on data
lines
V_IL(I/O)
LOW-level input voltage on data
lines
V_I/O(idle)
voltage on data lines outside a
session
R_pu
internal pull-up resistance
between data lines and V_CC
I_edge
current from data lines when
active pull-up is active
I_IL(I/O)
LOW-level input current on data V_IL = 0.4 V
lines
I_IH(I/O)
HIGH-level input current on data V_IH = V_CC
lines
DATA LINES I/OUC, AUX1UC AND AUX2UC
V_OH(I/OUC) HIGH-level output voltage on
data lines
I_OH = −20 µA
V_OL(I/OUC)
LOW-level output voltage on
data lines
I_I/OUC = 1 mA
V_IH(I/OUC)
HIGH-level input voltage on data
lines
V_IL(I/OUC)
LOW-level input voltage on data
lines
Z_I/OUC(idle) impedance on data lines outside
a session
MIN.
TYP.
MAX. UNIT
−
15
−
pF
2
−
24
MHz
−
200
−
ns
−
200
−
ns
−
−
V_CC − 0.5 −
3.5
−
−
−
1.8
−
0
−
−
−
8
10
−
1
−
−
−
−
0.5
µs
V_CC + 0.1 V
−
V
300
mV
V_CC
V
0.8
V
0.4
V
12
kΩ
−
mA
−600
µA
10
µA
V_DD − 1 −
−
−
0.7V_DD −
0
−
10
−
V_DD + 0.2 V
300
mV
V_DD
V
0.3V_DD V
−
MΩ
1997 Nov 04
16