TDA8002 Datasheet, PDF (18/28 Pages) NXP Semiconductors – IC card interface

Philips Semiconductors
IC card interface
Product specification
TDA8002
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
Strobe input (STROBE)
f_STROBE
V_IL
V_IH
frequency on STROBE
LOW-level input voltage
HIGH-level input voltage
0
−
0
−
0.7V_DD −
Logic inputs (CLKSEL, CLKDIV1, CLKDIV2, MODE, CMDVCC and RSTIN); note 4
V_IL
LOW-level input voltage
V_IH
HIGH-level input voltage
Logic inputs (PRES, PRES); note 4
0
−
1.8
−
V_IL
V_IH
I_IL(PRES)
LOW-level input voltage
HIGH-level input voltage
LOW-level input current on
pin PRES
V_OL = 0 V
0
−
0.7V_DD −
−
−
I_IH(PRES)
HIGH-level input current on
pin PRES
−
−
20
0.3V_DD
V_DD
MHz
V
V
0.8
V
V_DD
V
0.3V_DD V
V_DD
V
−10
µA
10
µA
Protections
T_sd
I_CC(sd)
shut-down local temperature
shut-down current at V_CC
−
135
−
°C
−
−
90
mA
Timing
t_act
activation sequence duration
see Fig.9; guaranteed by −
180
220
µs
design
t_de
deactivation sequence duration see Fig.11; guaranteed by 50
70
90
µs
design
t₃
start of the window for sending see Figs 8 and 9
−
−
130
µs
CLK to the card
t₅
end of the window for sending see Fig.8
CLK to the card
150
−
−
µs
Notes
1. It may be necessary to put capacitors from XTAL1 and XTAL2 to ground depending on the choice of crystal or
resonator.
2. When the oscillator is stopped in mode 1, XTAL1 is set to HIGH.
3. The transition time and duty cycle definitions are shown in Fig.13; δ = -t-₁----t₊--¹---t--₂-
4. PRES and CMDVCC are active LOW; RSTIN and PRES are active HIGH.
5. CLKOUT transition time and duty cycle do not need to be tested.
1997 Nov 04
18