TDA8005A Datasheet, PDF (21/36 Pages) NXP Semiconductors – Low-power 3 V/5 V smart card coupler

Philips Semiconductors
Low-power (3 V/5 V) smart card coupler
Preliminary specification
TDA8005A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
V_DDA
V_DDD
V_n
I_n1
I_n2
I_n3
I_n4
I_n5
I_n6
I_n7
P_tot
T_stg
V_esd
T_j
PARAMETER
CONDITIONS
analog supply voltage
digital supply voltage
all input voltages
DC current into pins XTAL1, XTAL2, RxD,
TxD, RESET, INT1, T0 (port P34), P37,
P00 to P03, P11 to P17, P20 to P23 and
TEST1 to TEST4
DC current from or to pins AUX1 and AUX2
DC current from or to pins S1 to S5
DC current into pin DELAY
DC current from or to pin PRES
DC current from and to pins K0 to K5
DC current from or into pin ALARM
(according to option choice)
total power dissipation
storage temperature
T_amb = −25 to +85°C
electrostatic discharge
on pins I/O, V_CC, RST,
CLK and PRES
on other pins
junction temperature
−
MIN.
−0.3
−0.3
−0.3
−
−10
−30
−5
−5
−5
−5
−
−55
−6
−2
−
MAX.
UNIT
+6.5
V
+6.5
V
V_DD + 0.5 V
5
mA
+10
mA
+30
mA
+10
mA
+5
mA
+5
mA
+5
mA
500
mW
+150
°C
+6
kV
+2
kV
125
°C
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
R_th(j-a)
thermal resistance from junction to ambient in free air
LQFP64
QFP44
VALUE
70
60
UNIT
K/W
K/W
1998 Mar 20
21