UMA1022M Datasheet, PDF (2/20 Pages) NXP Semiconductors – Low cost dual frequency synthesizer for radio telephones

Philips Semiconductors
Low cost dual frequency synthesizer for
radio telephones
Product specification
UMA1022M
FEATURES
• Low phase noise
• Low current from 3 V supply
• Fully programmable dividers
• 3-line serial interface bus
• Input reference buffer configurable as an oscillator with
external crystal resonator
• Wide compliance voltage charge pump outputs
• Two power-down input control pins.
APPLICATIONS
• 900 MHz and 2 GHz digital radio telephones
• Portable battery-powered radio equipment.
GENERAL DESCRIPTION
The UMA1022M BICMOS device integrates prescalers,
programmable dividers, a crystal oscillator/buffer and
phase comparators to implement two phase-locked loops.
The device is designed to operate from 3 NiCd or a single
LiIon cell in pocket phones, or from an external 3 V supply.
The synthesizers operate at RF input frequencies up to
2.1 GHz and 550 MHz. All divider ratios are supplied via a
3-wire serial programming bus. The reference divider uses
a common, fully programmable part and a separate
subdivider section. In this way the comparison frequencies
are related to each other allowing optimum isolation
between charge pump pulses.
Separate power and ground pins are provided to the
analog (charge pump, prescaler) and digital (CMOS)
circuits. An independent supply for the crystal oscillator
section allows maximum frequency stability. The ground
leads should be externally short-circuited to prevent large
currents flowing across the die and thus causing damage.
V_DD and V_DDX must be at the same potential. V_CCA and
V_CCB must be equal to each other and equal to or greater
than V_DD (e.g. V_DD = 3 V and V_CCA = 5.5 V for wider VCO
control voltage range).
The charge pump currents (phase detector gain) are fixed
by internal resistances and controlled by the serial
interface. Only passive loop filters are necessary;
the charge pumps function within a wide voltage
compliance range to improve the overall system
performance.
Suitable pin layout is chosen to minimize coupling and
interference between signals entering or leaving the chip.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
V_DD
V_CCA, V_CCB
V_DDX
I_tot
digital supply voltage
analog supply voltages
crystal reference supply voltage
all supply currents
(I_DD + I_CCA + I_CCB + I_DDX) in active
mode
I_tot(pd)
f_RF
f_IF
f_xtal
f_PCmax
T_amb
total supply currents in power-down
mode
RF input frequency
IF input frequency
crystal reference oscillator frequency
maximum loop comparison frequency
operating ambient temperature
CONDITIONS
V_CCA = V_CCB ≥ V_DD
V_CCA = V_CCB ≥ V_DD
V_DDX = V_DD
E = 1; V_CCA = V_CCB = 3.0 V;
V_DDX = V_DD = 3.0 V
XON = 0
XON = 1
MIN.
2.7
2.7
2.7
−
−
−
TYP.
3.0
3.0
3.0
14.65
15.9
40
MAX.
5.5
5.5
5.5
−
−
−
UNIT
V
V
V
mA
mA
µA
V_CCA = V_CCB ≤ 4.0 V
300 −
2100 MHz
50
−
550 MHz
50
−
400 MHz
3
−
20
MHz
−
2000 −
kHz
−30 −
+85 °C
1998 Dec 09
2