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BUK78150-55 Datasheet, PDF (2/9 Pages) NXP Semiconductors – TrenchMOS transistor Standard level FET
Philips Semiconductors
TrenchMOS™ transistor
Standard level FET
Product specification
BUK78150-55
THERMAL RESISTANCES
SYMBOL
Rth j-sp
Rth j-amb
PARAMETER
From junction to solder point
From junction to ambient
CONDITIONS
Mounted on any PCB
Mounted on PCB of Fig.18
TYP.
12
-
MAX.
15
70
UNIT
K/W
K/W
STATIC CHARACTERISTICS
Tj= 25˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
V(BR)DSS
VGS(TO)
IDSS
IGSS
±V(BR)GSS
RDS(ON)
Drain-source breakdown
VGS = 0 V; ID = 0.25 mA
voltage
Tj = -55˚C
Gate threshold voltage
VDS = VGS; ID = 1 mA
Tj = 150˚C
Tj = -55˚C
Zero gate voltage drain current VDS = 55 V; VGS = 0 V;
Tj = 150˚C
Gate source leakage current VGS = ±10 V
Tj = 150˚C
Gate source breakdown voltage IG = ±1 mA
Drain-source on-state
VGS = 10 V; ID = 5 A
resistance
Tj = 150˚C
MIN.
55
50
2.0
1.2
-
-
-
-
-
16
-
-
TYP.
-
-
3.0
-
-
0.05
-
0.04
-
-
120
-
MAX.
-
-
4.0
-
4.4
10
100
1
10
-
150
277
UNIT
V
V
V
V
V
µA
µA
µA
µA
V
mΩ
mΩ
DYNAMIC CHARACTERISTICS
Tmb = 25˚C unless otherwise specified
SYMBOL PARAMETER
gfs
Forward transconductance
Ciss
Input capacitance
Coss
Output capacitance
Crss
Feedback capacitance
td on
Turn-on delay time
tr
Turn-on rise time
td off
Turn-off delay time
tf
Turn-off fall time
CONDITIONS
VDS = 25 V; ID = 5 A; Tj = 25˚C
VGS = 0 V; VDS = 25 V; f = 1 MHz
VDD = 30 V; ID = 5 A;
VGS = 10 V; RG = 10 Ω;
Tj = 25˚C
MIN.
0.5
-
-
-
-
-
-
-
TYP.
2.5
190
65
32
9
28
15
8
MAX.
-
240
80
45
14
42
23
12
UNIT
S
pF
pF
pF
ns
ns
ns
ns
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
Tj = -55 to 175˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
IDR
Continuous reverse drain
Tsp = 25˚C
current
IDRM
Pulsed reverse drain current Tsp = 25˚C
VSD
Diode forward voltage
IF = 2 A; VGS = 0 V
trr
Reverse recovery time
IF = 2 A; -dIF/dt = 100 A/µs;
Qrr
Reverse recovery charge
VGS = -10 V; VR = 30 V
MIN. TYP. MAX. UNIT
-
-
5.5 A
-
-
30
A
- 0.85 1.1 V
-
43
-
ns
- 0.16 -
µC
January 1998
2
Rev 1.000