TDA8776 Datasheet, PDF (15/20 Pages) NXP Semiconductors – 10-bit, 500 Msps Digital-to-Analog Converter DAC

Philips Semiconductors
10-bit, 500 Msps Digital-to-Analog
Converter (DAC)
PACKAGE OUTLINE
PLCC28: plastic leaded chip carrier; 28 leads
Product specification
TDA8776
SOT261-2
eE
y
X
25
26
28
1
4
β
k
pin 1 index
5
e
D
HD
19
A
18 ^{Z E}
E ^HE
e
12 k₁
11
vM A
ZD
B
vM B
eE
b_p
b₁
wM
A
A₄ ^A1
(A ₃)
L_p
detail X
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT
A
A₁
min.
A₃
A₄
max.
b_p
b₁ D⁽¹⁾ E ⁽¹⁾ e
e_D e_E H_D H_E
k
k₁
max.
L_p
v
w
y
Z_D(1) Z _E ⁽¹⁾
max. max.
β
mm
4.57
4.19
0.51
0.25
inches
0.180
0.165
0.020
0.01
3.05
0.53
0.33
0.81
0.66
11.58 11.58
11.43 11.43
1.27
10.92 10.92 12.57 12.57
9.91 9.91 12.32 12.32
1.22
1.07
0.51
1.44
1.02
0.18
0.18
0.10
2.16
2.16
45 ^o
0.12
0.021 0.032 0.456 0.456
0.013 0.026 0.450 0.450
0.05
0.430
0.390
0.430
0.390
0.495
0.485
0.495
0.485
0.048
0.042
0.020
0.057
0.040
0.007
0.007
0.004 0.085 0.085
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
OUTLINE
VERSION
IEC
SOT261-2
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-25
1996 Jun 04
15