PZ3032 Datasheet, PDF (11/14 Pages) NXP Semiconductors – 32 macrocell CPLD

Philips Semiconductors
32 macrocell CPLD
Product specification
PZ3032
PIN DESCRIPTIONS
PZ3032 – 44-Pin Plastic Leaded Chip Carrier
6
7
1
40
39
PLCC
17
18
29
28
Pin Function
1 IN1
2 IN3
3 V_DD
4 I/O–A0–CK1
5 I/O–A1
6 I/O–A2
7 I/O–A3
8 I/O–A4
9 I/O–A5
10 GND
11 I/O–A6
12 I/O–A7
13 I/O–A8
14 I/O–A9
15 V_DD
Pin Function
16 I/O–A10
17 I/O–A11
18 I/O–A12
19 I/O–A13
20 I/O–A14
21 I/O–A15
22 _GND
23 V_DD
24 I/O–B15
25 I/O–B14
26 I/O–B13
27 I/O–B12
28 I/O–B11
29 I/O–B10
30 GND
Pin Function
31 I/O–B9
32 I/O–B8
33 I/O–B7
34 I/O–B6
35 V_DD
36 I/O–B5
37 I/O–B4
38 I/O–B3
39 I/O–B2
40 I/O–B1
41 I/O–B0
42 GND
43 IN0–CK0
44 IN2–gtsn
SP00420
PZ3032 – 44-Pin Thin Quad Flat Package
44
1
34
33
TQFP
Pin Function
1 I/O–A3
2 I/O–A4
3 I/O–A5
4 GND
5 I/O–A6
6 I/O–A7
7 I/O–A8
8 I/O–A9
9 V_DD
10 I/O–A10
11 I/O–A11
12 I/O–A12
13 I/O–A13
14 I/O–A14
15 I/O–A15
11
12
23
22
Pin Function
16 GND
17 V_DD
18 I/O–B15
19 I/O–B14
20 I/O–B13
21 I/O–B12
22 I/O–B11
23 I/O–B10
24 GND
25 I/O–B9
26 I/O–B8
27 I/O–B7
28 I/O–B6
29 V_DD
30 I/O–B5
Pin Function
31 I/O–B4
32 I/O–B3
33 I/O–B2
34 I/O–B1
35 I/O–B0
36 GND
37 IN0/CK0
38 IN2–gtsn
39 IN1
40 IN3
41 V_DD
42 I/O–A0–CK1
43 I/O–A1
44 I/O–A2
SP00433
Package Thermal Characteristics
Philips Semiconductors uses the Temperature Sensitive Parameter
(TSP) method to test thermal resistance. This method meets
Mil-Std-883C Method 1012.1 and is described in Philips 1995 IC
Package Databook. Thermal resistance varies slightly as a function
of input power. As input power increases, thermal resistance
changes approximately 5% for a 100% change in power.
Figure 7 is a derating curve for the change in Θ_JA with airflow based
on wind tunnel measurements. It should be noted that the wind flow
dynamics are more complex and turbulent in actual applications
than in a wind tunnel. Also, the test boards used in the wind tunnel
contribute significantly to forced convection heat transfer, and may
not be similar to the actual circuit board, especially in size.
Package
44-pin PLCC
44-pin TQFP
Θ_JA
49.8°C/W
66.3°C/W
PERCENTAGE ⁰
REDUCTION IN
Θ_JA (%)
10
20
30
40
50
0
PLCC/
QFP
1
2
3
4
5
AIR FLOW (m/s)
SP00419A
Figure 7. Average Effect of Airflow on Θ_JA
1997 Feb 20
11