PMN27XPE_15 Datasheet, PDF (10/13 Pages) NXP Semiconductors – 20 V, single P-channel Trench MOSFET

NXP Semiconductors
PMN27XPE
20 V, single P-channel Trench MOSFET
10. Soldering
3.45
1.95
0.95
3.3 2.825
0.95
0.45 ^0.55
(6×) ^(6×)
0.7
(6×)
0.8
(6×)
2.4
Fig. 19. Reflow soldering footprint for TSOP6 (SOT457)
5.3
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot457_fr
1.475
5.05
1.475
1.5
(4×)
0.45
(2×)
1.45
(6×)
2.85
Fig. 20. Wave soldering footprint for TSOP6 (SOT457)
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot457_fw
11. Revision history
Table 8. Revision history
Data sheet ID
Release date
PMN27XPE v.1
20120920
Data sheet status
Product data sheet
Change notice
-
Supersedes
-
PMN27XPE
Product data sheet
All information provided in this document is subject to legal disclaimers.
20 September 2012
© NXP B.V. 2012. All rights reserved
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