ERA-3YEB361V Datasheet, PDF (9/10 Pages) Panasonic Semiconductor – PRODUCT SPECIFICATION FOR APPROVAL

Subject
Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION
Part No.
ERA3
Spec. No.
151-SRA-E102R
10－8
14. Tape and Reel Package
14.1 Structure and reel dimensions shall be as shown in the figure below.
Inaccordance with EIAJ ET-7200.
9.0 +/- 1.0
Carrier tape
Top tape
Adhesive tape
11.4 +/-
14.2 Carrier Tape Dimensions
Do
P1
P2
P0
B
Sprocket hole
E
F
W
Unit : mm
T
(mm)
(inch)
A
C hip hole
A
1.10±0.10
.043±.004
B
1.90±0.10
.074±.004
C hip resistor
W
8.00±0.20
.314±.008
F
3.50±0.05
.137±.002
E
1.75±0.10
.069±.004
(mm)
(inchi)
P1
4.00±0.10
.157±.004
P2
2.00±0.05
.079±.002
P0
4.00±0.10
.157±.004
D0
1.50
±
0.10
0
.059
± .004
0
T
0.70±0.05
.028±.002
14.3 Tapping specifications
14.3.1 Taping
(1) Minimum Bending Radius
There shall be no defection of chip and no breakage of carrier tape in case carrier tape
have been bent by minimum bending radius (15mm). Test shall be conducted for 1 time.
(2) Resistance to climate of top tape
The top tape shall not tear off after exposure at 60 ^oC, 90 %RH to 95 %RH for 120 h.
(3) Peeling strength
Peeling strength shall be within 0.049 N to 0.49 N. There shall be no burr or breakage
after test. Test method is as follows:
Panasonic Electronic Devices Co., Ltd.