ERA-3YEB361V Datasheet, PDF (5/10 Pages) Panasonic Semiconductor – PRODUCT SPECIFICATION FOR APPROVAL

Subject
Metal Film(Thin Film) Chip Resistors PRODUCT SPECIFICATION FOR INFORMATION
Part No.
ERA3
Spec. No.
151-SRA-E102R
10－4
7. Mechanical characteristic
Item
Specifications
Chip Resistor
Without distinct deforma-
tion in appearance
Bond strength
of the face
plating
Explanation
Substrate : Glass epoxy(t=1.6mm)
Span : 90mm
Bending distance:3mm (10 seconds)
1.0 1.0 1.0
(unit: mm)
± (0.5 % + 0.05Ω)
Solderability
Resistance to
Soldering Heat
Resistance to
Solvent
100
Termination should be
covered uniformly with
solder
(min. 95% coverage)
Resistors shall be dipped in the melted sol-
der bath at 235 ± 5 °C for 2 ± 0.5 sec.
Flux shall be removed from the surface
of termination with clean organic solvent.
± (0.5 % + 0.05Ω)
Resistors shall be dipped in the melted
solder bath at 270 ± 3°C for 10 ± 1 °C sec.
Without distinct
olvent solution : Isopropyl alcohol
deformation in appearance _{(1)Dipping 10 +/- 1 hours, dry in room}
condition for 30 +/- 10 minutes.
± (0.5 % + 0.05Ω)
(2)Ultrasonic wave washing : 5 +/- 1 min.
(0.3W/cm²,28kHz)
Dry in room condition for 30 +/-10
minutes.
Panasonic Electronic Devices Co., Ltd.