CM2009-05CP Datasheet, PDF (7/8 Pages) ON Semiconductor – VGA or DVI-I Port Companion Circuit

CM2009-05CP
Mechanical Specification
Package Specification
The CM2009-05CP is supplied in 14-bump, 5-4-5 Chip Scale Package (CSP).
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
14
Millimeters
Dim
Inches
Min Nom Max Min Nom Max
A1 ^{1.955 2.000 2.045 0.0770 0.0787 0.0805}
A2 ^{1.055 1.100 1.145 0.0415 0.0433 0.0451}
B1 ^{0.395 0.400 0.405 0.0156 0.0157 0.0159}
B2 ^{0.195 0.200 0.205 0.0077 0.0079 0.0081}
B3 ^{0.342 0.347 0.352 0.0135 0.0137 0.0139}
B4 ^{0.342 0.347 0.352 0.0135 0.0137 0.0139}
C1 ^{0.150 0.200 0.250 0.0059 0.0079 0.0098}
C2 ^{0.153 0.203 0.253 0.0060 0.0080 0.0100}
D1 ^{0.530 0.580 0.630 0.0209 0.0228 0.0248}
D2 ^{0.363 0.391 0.419 0.0143 0.0154 0.0165}
# per tape and
reel
3500
Controlling dimension: millimeters
Figure 2. Package Dimensions for
CM2009-05CP 14-bump Chip Scale Package
Rev. P2 | Page 7 of 8 | www.onsemi.com