CM1693-04DE Datasheet, PDF (7/8 Pages) ON Semiconductor – L-C LCD and Camera EMI Filter Array with ESD Protection

CM1693−04DE, CM1693−06DE, CM1693−08DE
PACKAGE DIMENSIONS
UDFN12, 2.5x1.35, 0.4P
CASE 517BD−01
ISSUE O
D
2X
0.10 C
PIN ONE
REFERENCE
ÉÉÉÉÉÉ 2X
0.10 C _{TOP VIEW}
0.05 C
DETAIL B
12X
0.05 C
NOTE 4
SIDE VIEW
A
L
L
B
L1
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
A
(A3)
ÇÇÉÇÇÉ ^{EXPOSED Cu}
MOLD CMPD
A3
A1
DETAIL B
A1
C
SEATING
PLANE
OPTIONAL
CONSTRUCTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
D 2.50 BSC
D2 1.90 2.10
E 1.35 BSC
E2 0.30 0.50
e 0.40 BSC
K 0.15 −−−
L 0.20 0.30
L1 −−− 0.05
12X L
D2
DETAIL A
1
6
E2
RECOMMENDED
SOLDERING FOOTPRINT*
K
12
e
7 _{12X b}
0.10 C A B
BOTTOM VIEW
0.05 C _{NOTE 3}
PACKAGE
OUTLINE
0.50
0.40
PITCH
2.20
12X
0.40
1.55
12X
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7