CM1693-04DE Datasheet, PDF (1/8 Pages) ON Semiconductor – L-C LCD and Camera EMI Filter Array with ESD Protection

CM1693-04DE,
CM1693-06DE,
CM1693-08DE
L-C LCD and Camera EMI
Filter Array with ESD
Protection
Product Description
The CM1693 is a family of pi−style EMI filter arrays with ESD
http://onsemi.com
protection, which integrates four, six or eight filters (C−L−C) into
a small−form factor, uDFN 0.40 mm pitch package. Each EMI filter
channel is implemented as a 3−pole L−C filter, where the component
values are 10 pF−26 nH−12 pF. The CM1693’s roll−off frequency at
−6 dB attenuation is 300 MHz and can be used in applications where
the data rates are as high as 140 Mbps. The CM1693 also provides
8
1
uDFN8
DE SUFFIX
CASE 517BC
12
1
uDFN12
DE SUFFIX
CASE 517BD
16
1
uDFN16
DE SUFFIX
CASE 517BE
greater than −30 dB attenuation over the 800 MHz to 6 GHz frequency
ELECTRICAL SCHEMATIC
range. The device includes ESD diodes on every pin that provide
a very high level of protection for sensitive electronic components
against possible electrostatic discharge (ESD). The ESD protection
Filter +
ESDn*
26 nH
10 pF 12 pF
Filter +
ESDn*
diodes connected to the filter ports are designed and characterized to
safely dissipate ESD strikes of ±18 kV, which is beyond the maximum
GND
requirement of the IEC61000−4−2 international standard.
This device is particularly well suited for wireless handsets, mobile
LCD modules and PDAs because of its small package format and
1 of 4, 6 or 8 EMI/RFI Filter Channels
with Integrated ESD protection
easy−to−use pin assignments. In particular, the CM1693 is ideal for
* See Package/Pinout Diagram for expanded pin information
EMI filtering and protecting data and control lines for the LCD display
and camera interface in mobile handsets.
The CM1693 is housed in space saving, low profile, 0.40 mm pitch
uDFN packages in a RoHS compliant, Pb−Free format.
Features
• 4, 6 or 8 Channels of EMI Filtering with Integrated ESD Protection
• Pi−Style EMI Filters in a Capacitor−Inductor−Capacitor (C−L−C)
Network
• +18 kV ESD Protection on Each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
• Greater than −35 dB Attenuation (Typical) at 1GHz
• uDFN Lead−Free Package with 0.40 mm Lead Pitch:
♦ 4−Ch. = 8−Lead uDFN
♦ 6−Ch. = 12−Lead uDFN
♦ 8−Ch. = 16−Lead uDFN
• uDFN Package size:
♦ 8−Lead: 1.70 mm x 1.35 mm
♦ 12−Lead: 2.50 mm x 1.35 mm
♦ 16−Lead: 3.30 mm x 1.35 mm
• Increased Robustness Against Vertical Impacts During
MARKING DIAGRAM
P93 MG
G
P936 MG
G
P938 MG
G
1
1
1
XXXX = Specific Device Code
M
= Month Code
G
= Pb−Free Package
(*Note: Microdot may be in either location)
ORDERING INFORMATION
Device
CM1693−04DE
CM1693−06DE
CM1693−08DE
Package
Shipping^†
uDFN−8 3000/Tape & Reel
(Pb−Free)
uDFN−12 3000/Tape & Reel
(Pb−Free)
uDFN−16 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Manufacturing Process
• These Devices are Pb−Free and are RoHS Compliant
Applications
• LCD and Camera Data Lines in Mobile Handsets
• I/O Port Protection for Mobile Handsets, Notebook
Computers, PDAs etc.
• Handheld PCs/PDAs
• LCD and Camera Modules
• EMI Filtering for Data Ports in Cell Phones, PDAs
or Notebook Computers.
• Wireless Handsets
© Semiconductor Components Industries, LLC, 2013
1
May, 2013 − Rev. 3
Publication Order Number:
CM1693/D