CM1693-04DE Datasheet, PDF (6/8 Pages) ON Semiconductor – L-C LCD and Camera EMI Filter Array with ESD Protection

CM1693−04DE, CM1693−06DE, CM1693−08DE
PACKAGE DIMENSIONS
UDFN8, 1.7x1.35, 0.4P
CASE 517BC−01
ISSUE O
D
A
2X
B
0.10 C
PIN ONE
REFERENCE
ÉÉÉÉ
E
2X
0.10 C
TOP VIEW
0.05 C
DETAIL B A
8X
0.05 C
NOTE 4
A1
SIDE VIEW
ÇÇÉÇÇÉ ^{EXPOSED Cu}
MOLD CMPD
A1
A3
DETAIL B
ALTERNATE
CONSTRUCTIONS
L
(A3)
L1
C
SEATING
PLANE
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
L
A3 0.13 REF
b 0.15 0.25
D 1.70 BSC
D2 1.10 1.30
E 1.35 BSC
E2 0.30 0.50
e 0.40 BSC
K 0.15 −−−
L 0.20 0.30
L1 −−− 0.05
DETAIL A
8X L
D2
1
E2
8X K
8
e
e/2
8X b
0.10 C A B
0.05 C NOTE 3
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
1.40
8X
0.40
1.55
0.50
8X
1
0.25
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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