MMDF2P03HDR2 Datasheet, PDF (6/10 Pages) ON Semiconductor – Power MOSFET 2 Amps, 30 Volts P−Channel SO−8, Dual

MMDF2P03HD
di/dt = 300 A/μs
Standard Cell Density
t_rr
High Cell Density
t_rr
t_b
t_a
t, TIME
Figure 11. Reverse Recovery Time (t_rr)
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous drain−to−source voltage and
drain current that a transistor can handle safely when it is
forward biased. Curves are based upon maximum peak
junction temperature and a case temperature (T_C) of 25°C.
Peak repetitive pulsed power limits are determined by using
the thermal response data in conjunction with the procedures
discussed in AN569, “Transient Thermal Resistance −
General Data and Its Use.”
Switching between the off−state and the on−state may
traverse any load line provided neither rated peak current
(I_DM) nor rated voltage (V_DSS) is exceeded, and that the
transition time (t_r, t_f) does not exceed 10 μs. In addition the
total power averaged over a complete switching cycle must
not exceed (T_J(MAX) − T_C)/(R_θJC).
A power MOSFET designated E−FET can be safely used
in switching circuits with unclamped inductive loads. For
reliable operation, the stored energy from circuit inductance
dissipated in the transistor while in avalanche must be less
than the rated limit and must be adjusted for operating
conditions differing from those specified. Although industry
practice is to rate in terms of energy, avalanche energy
capability is not a constant. The energy rating decreases
non−linearly with an increase of peak current in avalanche
and peak junction temperature.
Although many E−FETs can withstand the stress of
drain−to−source avalanche at currents up to rated pulsed
current (I_DM), the energy rating is specified at rated
continuous current (I_D), in accordance with industry
custom. The energy rating must be derated for temperature
as shown in the accompanying graph (Figure 13). Maximum
energy at currents below rated continuous I_D can safely be
assumed to equal the values indicated.
100
V_GS = 20 V
SINGLE PULSE
T_C = 25°C
10
1
Mounted on 2″ sq. FR4 board (1″ sq. 2 oz. Cu 0.06″
thick single sided) with one die operating, 10s max.
100 μs
1 ms
10 ms
dc
0.1
0.01
0.1
R_DS(on) LIMIT
THERMAL LIMIT
PACKAGE LIMIT
1
10
100
V_DS, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
Figure 12. Maximum Rated Forward Biased
Safe Operating Area
350
I_D = 6 A
300
250
200
150
100
50
0
25
50
75
100
125
150
T_J, STARTING JUNCTION TEMPERATURE (°C)
Figure 13. Maximum Avalanche Energy versus
Starting Junction Temperature
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