CM2009 Datasheet, PDF (4/6 Pages) California Micro Devices Corp – VGA Port Companion Circuit

CM2009
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
I_{CC_VIDEO} V_{CC_VIDEO} Supply Current
V_{CC_VIDEO} = 5.0 V; VIDEO inputs at V_{CC_VIDEO}
or GND
I_{CC_DDC}
I_{CC_SYNC}
V_{CC_DDC} Supply Current
V_{CC_SYNC} Supply Current
V_{CC_DDC} = 5.0 V
V_{CC_SYNC} = 5 V; SYNC inputs at GND or
V_{CC_SYNC}; SYNC outputs unloaded
V_{CC_SYNC} = 5 V; SYNC inputs at 3.0 V;
SYNC outputs unloaded
Min Typ Max Units
10 mA
10 mA
50 mA
2.0 mA
V_F
V_IH
V_IL
V_OH
V_OL
R_OUT
ESD Diode Forward Voltage
Logic High Input Voltage
Logic Low Input Voltage
Logic High Output Voltage
Logic Low Output Voltage
SYNC Driver Output Resistance
(CM2009−00 only)
I_F = 10 mA
1.0 V
V_{CC_SYNC} = 5.0 V; (Note 2)
2.0
V
V_{CC_SYNC} = 5.0 V; (Note 2)
0.6 V
I_OH = 0 mA, V_{CC_SYNC} = 5.0 V; (Note 2)
4.85
V
I_OL = 0 mA, V_{CC_SYNC} = 5.0 V; (Note 2)
0.15 V
V_{CC_SYNC} = 5.0 V; SYNC Inputs at GND or 3.0 V
65
W
R_OUT SYNC Driver Output Resistance
V_{CC_SYNC} = 5.0 V; SYNC Inputs at GND or 3.0 V;
15
W
(CM2009−02 only)
(Note ?)
V_OH−02 Logic High Output Voltage
(CM2009−02 only)
I_OH = 24 mA; V_{CC_SYNC} = 5.0 V;
(Note 2)
2.0
V
V_OL−02 Logic Low Output Voltage
(CM2009−02 only)
I_OL = 24 mA; V_{CC_SYNC} = 5.0 V;
(Note 2)
0.8 V
I_IN
I_OFF
V_ON
Input Current
VIDEO Inputs
SYNC_IN1, SYNC_IN2 Inputs
Level Shifting N−MOSFET ”OFF” State
Leakage Current
Voltage Drop Across Level−shifting
N−MOSFET when “ON”
V_{CC_VIDEO} = 5.0 V; V_IN = V_{CC_VIDEO} or GND
V_{CC_SYNC} = 5.0 V; V_IN = V_{CC_SYNC} or GND
(V_{CC_DDC} − V_{DDC_IN}) ≤ 0.4 V;
V_{DDC_OUT} = V_{CC_DDC}
(V_{CC_DDC} − V_{DDC_OUT}) ≤ 0.4 V;
V_{DDC_IN} = V_{CC_DDC}
V_{CC_DDC} = 2.5 V; V_S = GND; I_DS = 3 mA;
±1 mA
±1 mA
10 mA
10 mA
0.18 V
C_{IN_VID} VIDEO Input Capacitance
V_{CC_VIDEO} = 5.0 V; V_IN = 2.5 V; f = 1 MHz;
(Note 4)
4
pF
V_{CC_VIDEO} = 2.5 V; V_IN = 1.25 V; f = 1 MHz;
(Note 4)
4.5 pF
t_PLH
SYNC Driver L => H Propagation Delay C_L = 50 pF; V_CC = 5.0 V; Input t_R and t_F ≤ 5 ns
12 ns
t_PHL
SYNC Driver H => L Propagation Delay C_L = 50 pF; V_CC = 5.0 V; Input t_R and t_F ≤ 5 ns
12 ns
t_R, t_F
SYNC Driver Output Rise & Fall Times
C_L = 50 pF; V_CC = 5.0 V; Input t_R and t_F ≤ 5 ns
4
ns
V_ESD ESD Withstand Voltage
V_{CC_VIDEO} = V_{CC_SYNC} = 5 V; (Notes 3, 4 & ?)
±8
kV
1. All parameters specified over standard operating conditions unless otherwise noted.
2. These parameters apply only to the SYNC drivers. Note that R_OUT = R_T + R_BUFFER.
3. Per the IEC−61000−4−2 International ESD Standard, Level 4 contact discharge method. BYP, V_{CC_VIDEO} and V_{CC_SYNC} must be bypassed
to GND via a low impedance ground plane with a 0.2 mF, low inductance, chip ceramic capacitor at each supply pin. ESD pulse is applied
between the applicable pins and GND. ESD pulses can be positive or negative with respect to GND. Applicable pins are: VIDEO_1, VIDEO_2,
VIDEO_3, SYNC_OUT1, SYNC_OUT2, DDC_OUT1 and DDC_OUT2. All other pins are ESD protected to the industry standard ±2 kV
Human Body Model (MIL−STD−883, Method 3015). The bypass capacitor at the BYP pin may optionally be omitted, in which case the max.
ESD withstand voltage for the DDC_OUT1 and DDC_OUT2 pins is reduced to ±4 kV.
4. The SYNC_OUT pins on the CM2009−02 are guaranteed for 2 kV HBM ESD protection.
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