HPM10_16 Datasheet, PDF (2/18 Pages) ON Semiconductor – Power Management IC for Hearing Aids

HPM10
Key Features
Supports Multiple Battery Types: Can charge and manage
the power of multiple battery chemistries, including
rechargeable Li−ion and AgZn batteries. Ni−MH batteries
and disposable Zn−Air batteries can be detected as well. An
automatic chemistry detection system recognizes the battery
type.
Flexibility to Support Multiple Battery Sizes: The
charging parameters should be updated depending on the
battery size. Parameters corresponding to one battery size
can be stored in an One−Time Programmable (OTP)
memory at customer site.
Power Supply: Provides a clean supply to the hearing aid
DSP. When a Li−ion battery is used, a step−down capacitive
divider or Charge Pump is used, providing a voltage
between ~1.4 V and ~0.95 V. When a AgZn battery is used,
a linear regulator can be used, providing a 1.5 V max.
HPM10 can also directly provide the battery voltage to the
hearing aid DSP. Eg., when a Zn−Air battery is used or if the
DSP can handle the voltage of a AgZn battery.
Charger Communication Interface: Communicates the
status of the charging process and battery voltage to the
hearing aid charger and allows user interaction with
HPM10.
Information sent in this mode includes:
• Battery voltage level and charge current
• Charge Mode phase
• Battery chemistry type
• Fault conditions
Battery Life Optimization: High−precision current and
voltage sources are used to manage the battery charge curves
with the precision required to optimize battery life duration.
Battery Supervision: Ensures that the battery doesn’t fall
below critical levels. This helps to maximize battery life.
Non−Volatile Memory (OTP): Stores charging
parameters, trim codes, and general product specific
settings.
Power On and Off Management: Based on a smart method
between HPM10 and the hearing aid DSP.
Specification
Table 1. ABSOLUTE MAXIMUM RATING
Symbol
Parameter
Min
Max
Unit
VDDP
DC Supply Voltage for charging
−0.5
5.7
V
VDDIO
Digital I/O supply
−0.5
5.5
V
VDD_OTP
OTP Supply
−0.5
6.0
V
DVREG
Regulated supply for HPM10
−0.5
2.0
V
VBAT
DC supply voltage, battery connection
−0.5
5.5
V
VSSA
Analog ground
−0.5
V
VSS
Digital Ground
−0.5
V
VDDIO I/O pins SCL, SDA, CCIF
−0.5
VDDIO+0.3
V
VBAT I/O pins SWIN, CP1A, CP1B, CP2A, CP2B
−0.5
VBAT+0.3
V
VHA I/O pins
VHA, SWOUT, DS_EN, EXT_CLK, CLKDIV[2:0],
AGZN_REG_EN, WARN
−0.5
2.0 (Note 1)
V
I_REG
I_VDDP
Temp
Max DVREG Load Current
Max VDDP Source Current
Storage temperature
20
mA
30
mA
−50
85
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Max value should not exceed VBAT +0.3 V
Table 2. ELECTRICAL OVERSTRESS IMMUNITY
Test
Reference
ELECTROSTATIC DISCHARGE ON COMPONENT LEVEL:
ESD – HBM
JESD22 − A114
ESD − MM
JESD22 − A115
ESD − CDM
ESD−STM 5−3−1−1999
Latch−up
JESD78
2. All pins at room temperature
Test Conditions
2 kV (Note 2)
200 V
500 V all pins
100 mA @ 25°C
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